Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device
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- 作者：Hosung Lee ; Sanghyeon Baeg ; bau@hanyang.ac.kr ; Nelson Hua ; ShiJie Wen
- 关键词：Solder ball defect ; Solder ball fracture ; Intermittent failure ; Ball grid array package device ; AC-coupling ; Frequency characteristic
- 刊名：Microelectronics Reliability
- 出版年：2017
- 出版时间：February 2017
- 年：2017
- 卷：69
- 期：Complete
- 页码：88-99
- 全文大小：2473 K
- 卷排序：69
文摘
The electrical characteristics changing of the solder ball by fracture is studied. The effects of the solder ball fracture on the signal is investigated. The effects of the solder ball fracture on the signal differ by the fracture size. The effects of the solder ball fracture on the signal differ by the signal pattern. In simulation, the signal shows higher possibility of error in heavier bit stream.