Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux

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• 作者：G.K. Sujan^a ; ^{sgkumer@gmail.com} ; A.S.M.A. Haseeb^a ; ^{haseeb@um.edu.my} ; Hiroshi Nishikawa^b ; ^{nisikawa@jwri.osaka-u.ac.jp} ; M.A. Amalina^a ; ^{amalina@um.edu.my}
• 关键词：SAC solder alloy ; Microstructure ; Intermetallic compound ; Mechanical property
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：25 February 2017
• 年：2017
• 卷：695
• 期：Complete
• 页码：981-990
• 全文大小：4469 K
• 卷排序：695

文摘

BGA solder joints were prepared using Co nanoparticles doped flux. Interfacial reaction, shear strength and failure modes were investigated. Ductile to brittle transition was observed in undoped solder joints with aging. Only ductile failure modes were shown in Co doped solder joints.