Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering
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- 作者：J.H. Liu ; H.Y. Zhao
- 关键词：Ultrasonic-assisted soldering ; Intermetallic joints ; Microstructure ; Shear strength ; Nanoindentation
- 刊名：Journal of Alloys and Compounds
- 出版年：2017
- 出版时间：25 January 2017
- 年：2017
- 卷：692
- 期：Complete
- 页码：552-557
- 全文大小：2118 K
文摘
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Cu-Sn intermetallic joints were rapidly formed by ultrasonic-assisted TLP soldering.
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The formed Cu6Sn5 grains were remarkably refined and investigated by EBSD.
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The joints demonstrated more uniform mechanical properties and a high reliability.
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The results provide a new insight into the effects of ultrasonic on TLP soldering.