Effect of N2 flow rate on the microstructure and electrochemical behavior of TaNx films deposited by modulated pulsed power magnetron sputtering
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- 作者：L. Mendizabala ; lucia.mendizabal@tekniker.es" class="auth_mail" title="E-mail the corresponding author ; R. Bayó ; nb ; E. G-Berasateguia ; J. Barrigaa ; J.J. Gonzalezc
- 关键词：Tantalum nitride ; Modulated pulsed power magnetron sputtering ; Microstructure ; Surface topography ; Crystal structure ; Corrosion resistance ; Pitting potential
- 刊名：Thin Solid Films
- 出版年：2016
- 出版时间：1 July 2016
- 年：2016
- 卷：610
- 期：Complete
- 页码：1-9
- 全文大小：2597 K
文摘
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TaNX coatings deposited by MPPMS at different N2-to-Ar ratios have been evaluated.
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Columnar-free microstructure TaNx films are obtained at 0.25 N2-to-Ar ratio.
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Excellent corrosion resistance is observed for TaNx coatings in NaCl 0.06 M.
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An excess of nitrogen on the TaNx coatings compromises corrosion resistance.