The advances and characteristics of high-power diode laser materials processing

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• 作者：Li ; Lin
• 关键词：HPDL ; High-power diode laser ; Materials ; Processing ; Welding ; Hardening ; Marking ; Rapid prototyping ; Machining ; Soldering
• 刊名：Optics and Lasers in Engineering
• 出版年：2000
• 出版时间：October, 2000
• 年：2000
• 卷：34
• 期：4-6
• 页码：231-253
• 全文大小：428 K

文摘

This paper presents a review of the direct applications of high-power diode lasers for materials processing including soldering, surface modification (hardening, cladding, glazing and wetting modifications), welding, scribing, sheet metal bending, marking, engraving, paint stripping, powder sintering, synthesis, brazing and machining. The specific advantages and disadvantages of diode laser materials processing are compared with CO₂, Nd:YAG and excimer lasers. An effort is made to identify the fundamental differences in their beam/material interaction characteristics and materials behaviour. Also an appraisal of the future prospects of the high-power diode lasers for materials processing is given.