Effect of currents on the microstructure of directionally solidified Al–4.5 wt % Cu alloy

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• 作者：Changjiang Song^a ; ^{riversxiao@163.com"" rel=""nofollow} ; Yuanyi Guo^a ; Yunhu Zhang^a ; Hongxing Zheng^a ; Meng Yan^a ; Qingyou Han^b ; Qijie Zhai^a ; ^{qjzhai@shu.edu.cn"" rel=""nofollow}
• 关键词：A1. Directional solidification ; A1. Interface ; A1. Morphological stability ; B1. Alloys
• 刊名：Journal of Crystal Growth
• 出版年：2011
• 出版时间：1 June 2011
• 年：2011
• 卷：324
• 期：1
• 页码：235-242
• 全文大小：1502 K

文摘

This paper describes a comparative study on the effect of electric current pulse (ECP) and the semi-sinusoidal current (SSC) on the microstructure of directionally solidified Al–4.5 wt % Cu alloy. The experimental results indicate that both ECP and SSC can make the convex solid/liquid interface flat, reduce the primary spacing and the depth of mushy zone, and change the interface morphology from cellular to planar (i.e. delay the planar/cellular transition). Under the same heating power, SSC produces a greater influence on the microstructure than ECP. Limited effect of the current direction on microstructure is also observed. Generally, current flowing from the liquid to the solid have a stronger effect on the microstructure than those from the solid to the liquid. Possible mechanisms by which the current altes the microstructure of Al–4.5 wt % Cu alloy under directional solidification conditions are suggested.