Process design based on temperature field control for reducing the thermal residual stress in glass/glass laser bonding

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• 作者：Yanyi Xiao^a ; ^b ; Wen Wang^b ; Xingyang Wu^a ; Jianhua Zhang^a ; ^b ; ^{jhzhang@oa.shu.edu.cn}
• 关键词：Thermal residual stress ; Laser bonding ; Viscoelasticity ; ANSYS ; Temperature field
• 刊名：Optics & Laser Technology
• 出版年：2017
• 出版时间：1 June 2017
• 年：2017
• 卷：91
• 期：Complete
• 页码：85-91
• 全文大小：1333 K
• 卷排序：91

文摘

The stress field of glass/glass laser bonding is simulated. The effect of different temperature field control scales on the stress field is discussed. The optimization of bonding via temperature field control is validated experimentally. The mechanism of controlling the stress field is described.