Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO₂ nanoparticles

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• 作者：Yanni Wen^a ; Xiuchen Zhao^a ; ^{zhaoxiuchen@bit.edu.cn} ; Zhuo Chen^a ; Yue Gu^b ; Yong Wang^a ; Zhiwei Chen^a ; Xinyuan Wang^a
• 关键词：TiO2 nanoparticles size ; SAC105 solder ; Thermal cycling ; Joint reliability
• 刊名：Journal of Alloys and Compounds
• 出版年：2017
• 出版时间：5 March 2017
• 年：2017
• 卷：696
• 期：Complete
• 页码：799-807
• 全文大小：3895 K
• 卷排序：696

文摘

Nanoparticle size have great effects on the reliability of composite solder joint. Smaller-size nanoparticle improves solder joints reliability more effectively. The reasons of nanoparticles size affecting joints reliability were discussed. The stress change with temperature led to the change of the electric resistance.