Generation of near eutectic phase layer in Sn-15Bi solder joint during electro-migration

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• 作者：Chengchao Du^a ; Xue Wang^a ; ^b ; ^{wangxue2011@whu.edu.cn} ; Zhongmin Lai^c
• 关键词：Electro-migration ; Solder alloy ; Microstructure ; Non eutectic ; Phase transformation ; Up-hill diffusion
• 刊名：Materials Letters
• 出版年：2017
• 出版时间：15 March 2017
• 年：2017
• 卷：191
• 期：Complete
• 页码：193-195
• 全文大小：1198 K
• 卷排序：191

文摘

Near eutectic phase segregation was observed in Sn-15Bi solder joint. Near eutectic phase layer segregates near the anode side. Near eutectic phase segregation relies on the up-hill diffusion of Bi atom. The rapid diffusion of Bi atom relies on the electron flow and temperature.