Three-dimensional quasi-static interfacial crack growth simulations in thermo-mechanical environment by coupled FE-EFG approach
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- 作者：Himanshu Pathaka ; Akhilendra Singhb ; Indra Vir Singhc ; ivsingh@gmail.com" class="auth_mail" title="E-mail the corresponding author
- 关键词：Three-dimensional interfacial crack growth ; Coupled FE-EFG approach ; Stress intensity factors ; Thermo-elastic loading
- 刊名：Theoretical and Applied Fracture Mechanics
- 出版年：2016
- 出版时间：December 2016
- 年：2016
- 卷：86
- 期：part_PB
- 页码：267-283
- 全文大小：3541 K
文摘
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Coupled FE-EFG approach is used to solve 3-D interfacial crack growth problems under mechanical and thermos-elastic loading.
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Four enrichment functions are used to capture an interface crack front behaviour.
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Fatigue life of an interfacial edge crack body is found small as compared to the interfacial centre crack body.
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Crack gradually moves towards the weak material in case of interfacial crack growth simulations.
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Thermal shock loading exhibits more fatigue life as compared to equivalent mechanical load.