Investigations on the life cycle behavior of Cu-Al-Ni/polyimide shape memory alloy bi-morph at varying substrate thickness and actuation conditions

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• 作者：Akash K^a ; ^{akash.k1806@gmail.com}Author Vitae ; Mani Prabu S S^bAuthor Vitae ; Ashish K. Shukla^bAuthor Vitae ; Tameshwer Nath^aAuthor Vitae ; Karthick S^aAuthor Vitae ; I.A. Palani^a ; ^b ; ^{palaniia@iiti.ac.in} ; ^{palaniia@gmail.com}Author Vitae
• 关键词：Shape memory materials ; Cu-Al-Ni ; Bi-morph ; Phase transformation ; Life cycle
• 刊名：Sensors and Actuators A: Physical
• 出版年：2017
• 出版时间：1 February 2017
• 年：2017
• 卷：254
• 期：Complete
• 页码：28-35
• 全文大小：2286 K
• 卷排序：254

文摘

Cu-Al-Ni has been deposited on 50 μm and 75 μm Polyimide and without any post processing or training the developed bi-morph displayed shape memory effect. Joule heating was utilized for life cycle analysis and the bi-morph was tested at various voltages for 500 cycles at 0.05 Hz. Two-way effect has been achieved by using an elastic polyimide substrate and maximum edge displacement of 19 mm was recorded with plate heating. The austenite transformation temperature was found to be As = 215 °C and Af = 240 °C. The shape recovery ratio was calculated and it was found that 75 μm polyimide sheet has better recoverability of than 50 μm.