Plasticisation of Epoxy Resin Transfer Molding Substrate for Fabrication of Interdigital Capacitive Sensors

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• 作者：M. Kahali Moghaddam ; J. Hellmann ; W. Lang
• 关键词：Resin Transfer Molding (RTM6) ; Non-destructive sensing ; Composite Manufacturing ; Plasticised RTM6 ; Interdigital capacitive sensor
• 刊名：Procedia Engineering
• 出版年：2016
• 出版时间：2016
• 年：2016
• 卷：168
• 期：Complete
• 页码：1110-1113
• 全文大小：245 K
• 卷排序：168

文摘

Monitoring composite manufacturing by sensors is necessary for high-quality products. The sensors provide information from the internal composite state, at the same time constituting a wound. Under loads, these wounds might cause delamination. To eliminate the wound-effect, sensors can be made out of the identical resin which reinforces fibers. A frequently used thermoset resin for high performance applications is Resin-Transfer-Molding (RTM6). Thermosets are brittle after curing; which is unsuitable for sensor fabrication. By adding plasticizer, a flexible RTM6 substrate for fabricating sensors is obtained. Mechanical tests show an increase in breakage force by a factor of 2.1 compared to polyimide.