A laser nano-structured diamond tool in machining brittle material silicon causes a smaller hydrostatic stress, a less compressive normal stress, a lower temperature and a smaller cutting force.
The laser nano-structured diamond tool machining generates smaller chip volume and more beta-silicon phase.
The tool with V-shape groove can reduce the resistance to cutting during nanoscale machining process.
The potential energy of subsurface atoms for pyramid-structured tool is much lower than that of using non-structured tool and other structured tools.
The number of other atoms for pyramid-structured tool is much smaller than that of using non-structured tool and other structured tools.