A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation
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文摘

A laser nano-structured diamond tool in machining brittle material silicon causes a smaller hydrostatic stress, a less compressive normal stress, a lower temperature and a smaller cutting force.

The laser nano-structured diamond tool machining generates smaller chip volume and more beta-silicon phase.

The tool with V-shape groove can reduce the resistance to cutting during nanoscale machining process.

The potential energy of subsurface atoms for pyramid-structured tool is much lower than that of using non-structured tool and other structured tools.

The number of other atoms for pyramid-structured tool is much smaller than that of using non-structured tool and other structured tools.

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