Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint

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• 作者：Zhongmin Lai^a ; ^{justmselzm@126.com} ; Xinda Kong^a ; Qingrong You^a ; Xiubin Cao^b
• 关键词：Sn-Bi ; Co substrate ; CoSn3 IMCs ; Critical temperature ; Shear strength
• 刊名：Microelectronics Reliability
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：68
• 期：Complete
• 页码：69-76
• 全文大小：2162 K
• 卷排序：68

文摘

The transient liquid phase bonding process of Co/Solder/Co structure was first conducted in this investigation. The shear strength of Co/Sn-Bi/Co and Co/CoSn3 + Bi/Co joints was tested. The fracture mechanism of non-TLPB and TLPB joints was first investigated.