Low-frequency ‘delay time’ ultrasound and its effect on electroless Cu metallisation of a Pd activated dielectric material
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- 作者：Andrew J. Cobley ; a.cobley@coventry.ac.uk" class="auth_mail" title="E-mail the corresponding author ; Ignacio Tudela ; Bahaa Abbas ; Bilal Mkhlef
- 关键词：Ultrasound ; Sonochemistry ; Electroless ; Copper ; Deposition rate ; Porosity ; Palladium ; Printed circuit boards
- 刊名：Thin Solid Films
- 出版年：2015
- 出版时间：31 December 2015
- 年：2015
- 卷：597
- 期：Complete
- 页码：226-230
- 全文大小：747 K
文摘
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Continuous ultrasound only increases plating rate at high electrolyte temperatures.
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Continuous ultrasound removes Pd from catalysed substrate.
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‘Delay time’ ultrasound increases plating rate at lower electrolyte temperatures.
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‘Delay time’ ultrasound reduces porosity of electroless Cu deposit.
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‘Delay time ultrasound has no effect of crystal structure of electroless Cu deposit.