Improved thermoelectric transport properties of Cu_1.8S with NH₄Cl-derived mesoscale-pores and point-defects

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• 作者：Yao Yao^a ; Bo-Ping Zhang^a ; ^{bpzhang@ustb.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Jun Pei^a ; Ye-Mao Han^b ; Min Zhou^b
• 关键词：NH4Cl ; Point-defects ; Mesoscale pores ; Thermal conductivity
• 刊名：Ceramics International
• 出版年：2016
• 出版时间：15 November 2016
• 年：2016
• 卷：42
• 期：15
• 页码：17518-17523
• 全文大小：1849 K

文摘

In the present work, we have investigated the effect of NH₄Cl content (x) on the microstructure, phase structure and thermoelectric transport properties of Cu_1.8S-xNH₄Cl (x=0, 1, 5, 10, 15 wt%) bulks fabricated by combining mechanical alloying and spark plasma sintering. The addition of NH₄Cl introduces lots of mesoscale (0.1–2.0 µm) pores and point-defects such as rc">rce" class="mathImg" data-mathURL="/science?_ob=MathURL&_method=retrieve&_eid=1-s2.0-S0272884216313669&_mathId=si0007.gif&_user=111111111&_pii=S0272884216313669&_rdoc=1&_issn=02728842&md5=086c8ed3bf2d58dcfbb0bc3fa5e80112">rce" style="margin-top: -5px; vertical-align: middle" title="View the MathML source" src="/sd/grey_pxl.gif" data-inlimgeid="1-s2.0-S0272884216313669-si0007.gif">ript>rder="0" style="vertical-align:bottom" width="14" alt="View the MathML source" title="View the MathML source" src="http://origin-ars.els-cdn.com/content/image/1-s2.0-S0272884216313669-si0007.gif">ript>r hidden">roll">row>Vrow>row>Srow>row>••row>, rc">rce" class="mathImg" data-mathURL="/science?_ob=MathURL&_method=retrieve&_eid=1-s2.0-S0272884216313669&_mathId=si0008.gif&_user=111111111&_pii=S0272884216313669&_rdoc=1&_issn=02728842&md5=3ccce9bee20776db5e7ebe3d777654ee">rce" style="margin-top: -5px; vertical-align: middle" title="View the MathML source" src="/sd/grey_pxl.gif" data-inlimgeid="1-s2.0-S0272884216313669-si0008.gif">ript>rder="0" style="vertical-align:bottom" width="12" alt="View the MathML source" title="View the MathML source" src="http://origin-ars.els-cdn.com/content/image/1-s2.0-S0272884216313669-si0008.gif">ript>r hidden">roll">row>Crow>lrow>row>Srow>row>•row>row>, rc">rmulatext stixSupport mathImg" data-mathURL="/science?_ob=MathURL&_method=retrieve&_eid=1-s2.0-S0272884216313669&_mathId=si0009.gif&_user=111111111&_pii=S0272884216313669&_rdoc=1&_issn=02728842&md5=1cb9b186dcddc5f847baf1ef18300e51" title="Click to view the MathML source">Cl_i'r hidden">roll">row>Crow>lrow>row>irow>'row> and rc">rce" class="mathImg" data-mathURL="/science?_ob=MathURL&_method=retrieve&_eid=1-s2.0-S0272884216313669&_mathId=si0010.gif&_user=111111111&_pii=S0272884216313669&_rdoc=1&_issn=02728842&md5=0122665cf1c6b384a47b79024bced577">rce" style="margin-top: -5px; vertical-align: middle" title="View the MathML source" src="/sd/grey_pxl.gif" data-inlimgeid="1-s2.0-S0272884216313669-si0010.gif">ript>rder="0" style="vertical-align:bottom" width="11" alt="View the MathML source" title="View the MathML source" src="http://origin-ars.els-cdn.com/content/image/1-s2.0-S0272884216313669-si0010.gif">ript>r hidden">roll">row>Hrow>row>irow>row>•row>, leading to a decreased carrier mobility and an increased carrier concentration, respectively. As a result, the thermal conductivity was effectively reduced from 2.1 to 1.2 W m⁻¹ K⁻¹ as increasing x from 0 to 10 wt% at 673 K. A peak ZT value of 0.3 was achieved at 673 K for x=1 wt% resulted from a low thermal conductivity of 1.6 W m⁻¹ K⁻¹ combining an appropriate power factor of 717 μWm⁻¹K⁻², which is 15% higher than that (0.26) of pristine Cu_1.8S. Our result indicates that the introduction of NH₄Cl in thermoelectric materials is an effective and convenient strategy to improve ZT by decreasing thermal conductivity.