Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials
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- 作者：Melissa A. Peacocka ; Chandan K. Roya ; ckr0005@auburn.edu" class="auth_mail" title="E-mail the corresponding author ; Michael C. Hamiltonb ; R. Wayne Johnsonc ; Roy W. Knighta ; Daniel K. Harrisa
- 关键词：Carbon nanotube ; Vertically aligned carbon nanotubes ; Thermal interface material ; Thermal resistance
- 刊名：International Journal of Heat and Mass Transfer
- 出版年：2016
- 出版时间：June 2016
- 年：2016
- 卷：97
- 期：Complete
- 页码：94-100
- 全文大小：1118 K
文摘
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High quality vertically aligned carbon nanotubes (VACNTs) were fabricated on silicon substrate.
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VACNTs were transferred from silicon to copper substrate using a novel technique.
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Thermal performance was tested using ASTM D5470 methodology.
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The lowest thermal resistance achieved was 0.425 cm2-K/W at 50 psi.
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Slight pressure dependency was observed from 20 to 50 psi.