Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF
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- 作者：Lei Sua ; b ; Tielin Shib ; Zhiping Liuc ; Hongdi Zhoub ; Li Dub ; Guanglan Liaob ; guanglan.liao@hust.edu.cn" class="auth_mail" title="E-mail the corresponding author
- 关键词：Flip chip ; Nondestructive diagnosis ; Principal component analysis ; Radial basis function ; Vibration analysis
- 刊名：Mechanical Systems and Signal Processing
- 出版年：2017
- 出版时间：15 February 2017
- 年：2017
- 卷：85
- 期：Complete
- 页码：849-856
- 全文大小：859 K
文摘
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This paper presents a nondestructive diagnosis method for defect detection of flip chips.
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Forty-two features were extracted from vibration signals for analysis.
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PCA-RBF was introduced for feature reduction and defect assessment.
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The results demonstrate the feasibility of this approach for flip chip diagnosis.