Numerical study on the mechanism of active interfacial debonding detection for rectangular CFSTs based on wavelet packet analysis with piezoceramics
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文摘

A multi-physics coupling finite element model (FEM) is constructed to simulate the stress wave propagation within CFST members with interface debonding.

The stress wave fields of CFST without and with interface debonding defects are compared.

The index based on the wavelet packet analysis is sensitive to the interfacial debonding defect.

The results indicate that the interfacial defect leads to the changes in the propagation path, travel time and magnitude of stress waves.

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