Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation
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- 作者：Wahyu Diyatmikaa ; J.P. Chua ; jpchu@mail.ntust.edu.tw" class="auth_mail ; Y.W. Yena ; W.Z. Changa ; C.H. Hsuehb
- 关键词：Tin Whiskers ; Electronic Packaging ; Intermetallic Compound ; Thin Film Metallic Glass ; Underlayer
- 刊名：Thin Solid Films
- 出版年：30 June 2014
- 年：2014
- 卷：561
- 期：Complete
- 页码：93-97
- 全文大小：1445 K
文摘
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Zr46Ti26Ni28 thin film metallic glass (TFMG) has an amorphous structure.
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TFMG underlayer influences the surface morphology of the Sn overlay.
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TFMG effectively impedes interactions between Sn and Cu at room temperature.
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Due to the absence of Sn/Cu interactions, formation of Sn whiskers is mitigated.