Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating
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- 作者：Ming Lv ; Jianguo Liu ; liujg@mail.hust.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Suhuan Wang ; Jun Ai ; Xiaoyan Zeng
- 关键词：Laser direct writing ; Selective metallization ; Chemical cleaning ; Electroless copper plating
- 刊名：Applied Surface Science
- 出版年：2016
- 出版时间：15 March 2016
- 年：2016
- 卷：366
- 期：Complete
- 页码：227-232
- 全文大小：2181 K
文摘
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Mechanisms of laser direct writing and electroless plating were studied.
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Active seeds in laser-irradiated zone and laser-affected zone were found to be different.
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A special chemical cleaning method with aqua regia was taken.
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Higher-resolution copper patterns on alumina ceramic were obtained conveniently.