Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging
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- 作者：Fengjiang Wanga ; b ; fjwang@just.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Lili Zhoua ; Xiaojing Wanga ; Peng Heb
- 关键词：Sn-58Bi ; Cu-Zn ; Solder ; Bending strength ; IMC growth ; Fracture mode
- 刊名：Journal of Alloys and Compounds
- 出版年：2016
- 出版时间：15 December 2016
- 年：2016
- 卷：688
- 期：part_PA
- 页码：639-648
- 全文大小：3812 K
文摘
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Minor Zn in Cu pad improves the interfacial structure and mechanical behavior of Sn-Bi joint.
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IMC growth was depressed, and Bi segregation and Kirkendall voids were avoided.
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Fracture was transformed from brittle mode into ductile or partly brittle mode.