Electrodeposition mechanism and characterization of Ni-Cu alloy coatings from a eutectic-based ionic liquid
详细信息 查看全文
- 作者：Shaohua Wang ; Xingwu Guo ; Haiyan Yang ; JiChun Dai ; Rongyu Zhu ; Jia Gong ; Liming Peng ; Wenjiang Ding
- 关键词：Electrodeposition ; Ionic liquid ; Ni&ndash ; Cu alloy ; Nucleation ; Corrosion resistance
- 刊名：Applied Surface Science
- 出版年：1 January, 2014
- 年：2014
- 卷：288
- 期：Complete
- 页码：530-536
- 全文大小：1725 K
文摘
The electrodeposition mechanism, microstructures and corrosion resistances of Ni-Cu alloy coatings on Cu substrate were investigated in a choline chloride-urea (1:2 molar ratio) eutectic-based ionic liquid (1:2 ChCl-urea IL) containing nickel and copper chlorides. Cyclic voltammetry showed that the onset reduction potentials for Cu (鈭尖垝0.32 V) and for Ni (鈭尖垝0.47 V) were close to each other, indicating that Ni-Cu co-deposition could be easily achieved in the absence of complexing agent which was indispensable in aqueous plating electrolyte. Chronoamperometric investigations revealed that Ni-Cu deposits followed the three-dimensional instantaneous nucleation/growth mechanism, thus producing a solid solution. The compositions, microstructures and corrosion resistances of Ni-Cu alloy coatings were significantly dependent on the deposition current densities. Ni-Cu alloy coatings were 伪-Ni(Cu) solid solutions, and the coating containing 鈭?7.6 at.% Cu exhibited the best corrosion resistance because of its dense and crack-free structure.