Thermophysical properties of SiC/Al composites with three dimensional interpenetrating network structure
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- 作者：Shun Li ; linudt@163.com" class="auth_mail ; Degan Xiong ; Meng Liu ; Shuxin Bai ; Xun Zhao
- 关键词：Metal matrix composites ; Thermophysical properties ; Interpenetrating structure ; Electronic packaging
- 刊名：Ceramics International
- 出版年：June, 2014
- 年：2014
- 卷：40
- 期：5
- 页码：7539-7544
- 全文大小：1867 K
文摘
Silicon carbide (SiC) reinforced aluminum composites with three dimensional interpenetrating network structure (3D-SiC/Al) were fabricated by the gas pressure infiltration method, and their thermophysical properties were investigated. The results show that the geometry of SiC reinforcement has a significant impact on the thermophysical properties of the composites. Continuous SiC reinforced aluminum composites (3D-SiC/Al) have higher thermal conductivities and lower coefficients of thermal expansion (CETs) than those of particulate SiC reinforced aluminum composites (SiCp /Al) with the same SiC volume fraction. The co-continuous structures of both the SiC reinforcement and the Al matrix in 3D-SiC/Al can be the reason behind this phenomena. As a result, when SiC volume fraction values were the same, 3D-SiC/Al composites will be more suitable for electronic packaging applications comparing with SiCp/Al composite.