Dielectric properties under high electric field for silicon doped alumina thin film with glass-like structure derived from sol-gel process
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Dielectric Si-doped alumina thin films were prepared by sol-gel method.

Alsingle bondlimg="/entities/sbnd" src="/sd/grey_pxl.gif" class="glyphImg imgLazyJSB">Osingle bondlimg="/entities/sbnd" src="/sd/grey_pxl.gif" class="glyphImg imgLazyJSB">Si bonds and cation vacancies lineImage" height="18" width="22" alt="View the MathML source" title="View the MathML source" src="/sd/grey_pxl.gif" data-inlimgeid="1-s2.0-S0925838816321594-si1.gif"> are produced by substitutive behavior.

Excellent dielectric properties of Si-doping alumina thin films were achieved.

The leakage current reduces two orders of magnitude when Si concentration is 2mol%.

Breakdown strength increased by 93%, comparing with undoped alumina film.

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