Thermal control of electronic equipment by heat pipes

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• 作者：Groll ; Manfred ; Schneider ; Marcus ; Sartre ; Valé ; rie ; Zaghdoudi ; Mohamed Chaker ; Lallemand ; Monique
• 关键词：heat pipe ; micro heat pipe ; electronic component ; electronic chip ; cooling ; capillary structure ; capillary pressure ; caloduc ; microcaloduc ; composant é ; lectronique ; puce é ; lectronique ; refroidissement ; structure capillaire ; pression capillaire
• 刊名：Revue Generale de Thermique
• 出版年：1998
• 出版时间：May, 1998
• 年：1998
• 卷：37
• 期：5
• 页码：323-352
• 全文大小：2.79 M

文摘

In the frame of the BRITE-EURAM european programme (KHIEPCOOL project), a literature survey on the main heat pipe and micro heat pipe technologies developed for thermal control of electronic equipment has been carried out. The conventional heat pipes are cylindrical, flat or bellow tubes, using wicks or axial grooves as capillary structures. In the field of micro heat pipes, three and four corner tubes have been developed. The pipes are mounted on single chips, in-line chip arrays or integrated into the component interconnection substrate. The best performances were achieved with Plesch's axially grooved flat miniature heat pipe, which is able to transfer a heat flux of about 60 W·cm⁻². Theoretical models have shown that the performance of micro heat pipe arrays increase with increasing tube diameter, decreasing tube length and increasing heat pipe density. The heat pipe technologies are classified and compared according to their geometry and location in the system. A list of about 150 references, classified according to their subjects, is presented.