刊名:AEU - International Journal of Electronics and Communications
出版年:2007
出版时间:1 March 2007
年:2007
卷:61
期:3
页码:158-162
全文大小:675 K
文摘
A SOI-based optical board technology is presented. Hybrid integration combines the strength of silicon and InP. The SOI board provides passive optical components and acts as the mounting platform. Adapted active III/V devices are integrated using Au/Sn solder technology and passive alignment. Precise mounting of lasers on the board is necessary to ensure low coupling losses.