UV/ozone treatment for adhesion improvement of copper/epoxy interface

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• 作者：Shingyu Bok ; Guh-Hwan Lim ; Byungkwon Lim ; ^{blim@skku.edu}
• 关键词：Adhesion ; UV/ozone ; Copper ; Epoxy ; Silane coupling agent
• 刊名：Journal of Industrial and Engineering Chemistry
• 出版年：2017
• 出版时间：25 February 2017
• 年：2017
• 卷：46
• 期：Complete
• 页码：199-202
• 全文大小：1087 K
• 卷排序：46

文摘

We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1 μm.