Repair bond strength of dual-cured resin composite core buildup materials
详细信息    查看全文
文摘
The reparability of dual-cured resin composite core buildup materials using a light-cured one following one week or three months storage, prior to repair was evaluated. Two different dual-cured resin composites; Cosmecore™ DC automix and Clearfil™ DC automix core buildup materials and a light-cured nanofilled resin composite; Filtek™ Z350 XT were used. Substrate specimens were prepared (n = 12/each substrate material) and stored in artificial saliva at 37 °C either for one week or three months. Afterward, all specimens were ground flat, etched using Scotchbond™ phosphoric acid etchant and received Single Bond Universal adhesive system according to the manufacturers’ instructions. The light-cured nanofilled resin composite (Filtek™ Z350 XT) was used as a repair material buildup. To determine the cohesive strength of each solid substrate material, additional specimens from each core material (n = 12) were prepared and stored for the same periods. Five sticks (0.8 ± 0.01 mm2) were obtained from each specimen (30 sticks/group) for microtensile bond strength (μTBS) testing. Modes of failure were also determined. Two-way ANOVA revealed a significant effect for the core materials but not for the storage periods or their interaction. After one week, dual-cured resin composite core buildup materials (Cosmecore™ DC and Clearfil™ DC) achieved significantly higher repair μTBS than the light-cured nanofilled resin composite (Filtek™ Z350 XT). However, Clearfil™ DC revealed the highest value, then Cosmecore™ DC and Filtek™ Z350 XT, following storage for 3-month. Repair strength values recovered 64–86% of the cohesive strengths of solid substrate materials. The predominant mode of failure was the mixed type. Dual-cured resin composite core buildup materials revealed acceptable repair bond strength values even after 3-month storage.

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700