Comparative study of printed circuit board recycling by cracking of internal layers using organic solvents-dimethylformamide and dimethylacetamide
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文摘
Substrate resin dissolution results in liberation of metal-nonmetal layers. Dimethylacetamide (DMAc) showed better resin dissolution than dimethylformamide. Spent DMAc was recycled and dissolved solute recovered as residue. Chemical structure and boiling point of DMAc was unaltered after regeneration. Residue exhibit similar chemical structure as untreated resin.

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