Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink

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• 作者：S.F. Sufian^a ; ^{sufianfarid@gmail.com} ; M.Z. Abdullah^b
• 关键词：LED package ; Piezoelectric fan ; Heat sink ; Transient numerical simulation ; MpCCI ; Junction temperature
• 刊名：Microelectronics Reliability
• 出版年：2017
• 出版时间：January 2017
• 年：2017
• 卷：68
• 期：Complete
• 页码：39-50
• 全文大小：2235 K
• 卷排序：68

文摘

The thermal analysis of LED package cooled by a combination of multiple piezoelectric fans and a heat sink is performed. The thermal characterizations of resistance (R), junction temperature (TJ), and average convection coefficient (h−) for dual and quadruple vibrating fans have been experimentally investigated, followed by a numerical analysis. Varying separation distances between the two vibrating fans in array were examined at their respective heat sink slots, and the separation distance influences the thermal behavior remarkably. 3D coupling based on a dynamic meshing scheme was conducted with FLUENT and ABAQUS with the use of the code coupling interface MpCCI to estimate the thermal field. The estimated results were compared with experimental findings to substantiate the numerical solution.