The cracking resistance of HPC considering curing temperature was studied by TSTM.
The ratios of cracking stress to tensile strength for HPC were all lower than 1.0.
The autogenous shrinkage of HPC increased with the increase of curing temperature.
A model for autogenous shrinkage of HPC was proposed considering curing temperature.
The HPC specimens cured at isothermal 20 °C showed better cracking resistance.