Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging

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• 作者：Hongjun Ji ; ^{jhj7005@hit.edu.cn} ; Jiao Wang ; Mingyu Li
• 关键词：Au stud ; Au-Sn compounds ; Interconnections ; Electromigration ; Reliability ; Power electronics
• 刊名：Microelectronics Reliability
• 出版年：2016
• 出版时间：November 2016
• 年：2016
• 卷：66
• 期：Complete
• 页码：134-142
• 全文大小：2287 K
• 卷排序：66

文摘

Hybrid interconnects of Au stud bumps/SnCu solder were produced on Cu by flip-chip. AuSn4 intermetallic with big fraction was the main IMCs in the hybrid joints. The reliability and fracture mode were influenced by AuSn4 and Kirkendall voids. The hybrid joints have good electromigration resistance.