Fracture toughness of silicon in nanometer-scale singular stress field
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- 作者：Takashi Sumigawa ; sumigawa@cyber.kues.kyoto-u.ac.jp" class="auth_mail" title="E-mail the corresponding author ; Shinsaku Ashida ; Shuhei Tanaka ; Kazunori Sanada ; Takayuki Kitamura
- 关键词：Fracture toughness ; Singular stress field ; Crack ; Nanoscale ; Silicon ; Single crystal
- 刊名：Engineering Fracture Mechanics
- 出版年：2015
- 出版时间：December 2015
- 年：2015
- 卷：150
- 期：Complete
- 页码：161-167
- 全文大小：1156 K
文摘
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We successfully introduced a short crack into a single-crystal Si micro-specimen.
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The singular stress field size in micro-specimens with a crack is 23–57.9 nm.
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The crack propagation behavior was directly observed by means of a TEM.
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The KIC in a nanometer-scale is equivalent to that of the bulk counterpart.
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The fracture toughness in a nanometer-scale is independent of the size.