We prepared 36 mm thickness of FPCB composed of copper and polyimide.

We successfully fabricated micro via-hole diameter of 15 mm, 35 mm, 50 mm and 85 mm by using AWAVE-355(Advanced Optowave).

We especially achieved the size of via-hole that is less than 15 mm of diameter, which has 95% of roundness and 80° of taper angle.

The drilling speed of 2800 holes per second is faster than current industry one which is 2000 holes per second.

We applied modified the Greedy 2-opt algorithm to UV-laser drilling to reduce the time of hole fabrication.

We successfully reduced the production time approximately 23%.

In order to get accurate via-hole, the Canny edge detection algorithm and pattern matching algorithm were used to detect the defective micro via-holes automatically.

We could detect defective or mis-fabricated holes using the pattern matching and Canny edge detection algorithms.

We successfully fabricate tiny via-hole by using UV laser system as well as quickly exact via-hole was formed with algorithms.