Diffusion Bonding between Zr-Based Metallic Glass and Copper

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• 作者：Kou Hongchao ; ^{hchkou@nwpu.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Guan Heng ; Wang Jun ; Tang Bin ; Li Jinshan
• 关键词：diffusion bonding ; metallic glass ; interlayer ; interface
• 刊名：Rare Metal Materials and Engineering
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：45
• 期：1
• 页码：42-45
• 全文大小：917 K

文摘

The diffusion bonding capability between Zr_41.25Ti_13.75Cu_12.5Ni₁₀Be_22.5 bulk metallic glass and pure Cu with and without interlayer was studied on a Gleeble3500 thermomechanical simulator. Experimental results show that good diffusion bonding joints without cracks and voids can be obtained under both conditions. Atomic diffusion at the interface is obviously observed using EDS and EPMA methods, while the diffusion zones are very narrow. The crystalline phases transformed from amorphous state will accelerate the atomic diffusion at the interface.