Dissolution and separation of brominated epoxy resin of waste printed circuit boards by using di-methyl formamide
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- 作者：Himanshu Ranjan Verma ; hrverma.rs.met13@itbhu.ac.in" class="auth_mail" title="E-mail the corresponding author ; Kamalesh K. Singh ; Tilak Raj Mankhand
- 关键词：Waste printed circuit boards (WPCBs) ; Brominated epoxy resin (BER) ; Dimethylformamide (DMF) ; Dissolution ; Delamination ; Separation
- 刊名：Journal of Cleaner Production
- 出版年：2016
- 出版时间：15 December 2016
- 年：2016
- 卷：139
- 期：Complete
- 页码：586-596
- 全文大小：2908 K
文摘
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The DMF dissolves BER present in WPCBs.
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Regenerated DMF showed similar chemical composition and structure as pure DMF.
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Solid residue obtained after regeneration was BER.
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Efficiency of regenerated DMF to dissolve BER is similar to that of unused DMF.
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Significant delamination and separation of components achieved for 1cm2 size WPCBs.