Study on machining 3D micro mould cavities using reciprocating micro ECM with queued foil microelectrodes

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• 作者：Bo Wu^a ; Xiao-yu Wu^a ; ^b ; ^{wuxy@szu.edu.cn} ; Jian-guo Lei^a ; ^b ; ^{ljg_sc111@163.com} ; Bin Xu^a ; ^b ; Shuang-chen Ruan^a ; Jin-ming Zhong^a
• 关键词：Queued foil microelectrode ; Insulation film ; Micro ECM ; 3D micro mould cavity
• 刊名：Journal of Materials Processing Technology
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：241
• 期：Complete
• 页码：120-128
• 全文大小：3120 K
• 卷排序：241

文摘

The paper proposes a method for processing 3D micro mould cavities using reciprocating micro electrochemical machining (micro ECM) with queued foil microelectrodes. Specifically, the queued foil microelectrodes were machined from 60-μm-thick 304 stainless steel foils via wire electrical discharge machining (WEDM). In addition, both undersurfaces of these foil microelectrodes were sputter coated with SiO2 insulation films. Research on the blind holes machining using single foil microelectrodes indicated that when a NaNO3 electrolyte reached a concentration of 2.5 g/L, 50-μm back-off distance, and 9 ∼ 30 V machining voltage, the inlet width of the micro mould cavity was controllable within 200 ± 10 μm, regardless of the machining depth. Moreover, when the machining voltage was 30 V, the machining efficiency was observed to be highest. Based on the optimised parameters for blind holes machining with single foil microelectrodes and a machining layer thickness of 70 μm, 3D micro mould cavities with a simple blind hole, rectangular island, and semicircular island with a machining depth exceeding 1000 μm were obtained using reciprocating micro ECM with queued foil microelectrodes sputter coated with SiO2 insulation film. Compared with 3D micro mould cavities machined using layered electrolytic milling with 1D micro-cylindrical electrode, the cross-section of the 2D microelectrodes exhibited a strong anti-interference property and outstanding efficiency. Compared with unidirectional feeding micro ECM of 3D microelectrode, the fabrication of such 2D microelectrodes was very simple and flow field in micro ECM processing was greatly improved, which can execute the machining of 3D micro mould cavities with a high-aspect-ratio.