Towards Structural Analysis of Polymeric Contaminants in Electrodeposited Cu films
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- 作者：Pavel Moreno-Garcí ; aa ; 1 ; Valentine Grimaudoa ; 1 ; Andreas Riedob ; Marek Tulejb ; Maike B. Neulandb ; Peter Wurzb ; Peter Broekmanna ; peter.broekmann@dcb.unibe.ch" class="auth_mail" title="E-mail the corresponding author
- 关键词：Electroplating ; Damascene process ; additives ; chemical depth profiling ; laser ablation/ionization mass spectrometry (LIMS)
- 刊名：Electrochimica Acta
- 出版年：2016
- 出版时间：1 May 2016
- 年：2016
- 卷：199
- 期：Complete
- 页码：394-402
- 全文大小：2049 K
文摘
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LIMS depth profiling provides truly quantitative information on the additive embedment into Cu films.
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Contaminations preferentially accumulate at grain boundaries inside the Cu film.
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The novel LIMS desorption mode allows for the structural analysis of embedded polymers.