Study of direct Cu electrodeposition on ultra-thin Mo for copper interconnect
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- 作者：Xu Wang ; Li-Ao Cao ; Guang Yang ; Xin-Ping Qu ; xpqu@fudan.edu.cn" class="auth_mail" title="E-mail the corresponding author
- 关键词：Direct Cu electrodeposition ; Electroplating ; Molybdenum ; Interconnect ; Ethylenediamine ; Alkaline electroplating bath
- 刊名：Microelectronic Engineering
- 出版年：2016
- 出版时间：1 October 2016
- 年：2016
- 卷：164
- 期：Complete
- 页码：7-13
- 全文大小：1694 K
文摘
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The direct electrodeposition of Cu on Mo in neutral bath was reported originally.
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Corrosion rate of Mo is much lower in neutral bath than that in acidic bath.
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Hemispherical Cu nuclei are achieved in neutral bath rather than dendritic ones.
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The density Cu nuclei on Mo in neutral bath is much higher than that in acid bath.
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A two-step plating process was applied to lower the resistivity of direct ECD Cu.