The direct electrodeposition of Cu on Mo in neutral bath was reported originally.
Corrosion rate of Mo is much lower in neutral bath than that in acidic bath.
Hemispherical Cu nuclei are achieved in neutral bath rather than dendritic ones.
The density Cu nuclei on Mo in neutral bath is much higher than that in acid bath.
A two-step plating process was applied to lower the resistivity of direct ECD Cu.