Deposition of hermetic silver shells onto copper flakes

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• 作者：John I. Njagi ; Christopher M. Netzband ; Dan V. Goia ; ^{goiadanv@clarkson.edu}
• 关键词：Copper flakes ; Silver nanoparticles ; Galvanic displacement ; Glucose ; Silver diamine ; Electroless plating
• 刊名：Journal of Colloid and Interface Science
• 出版年：2017
• 出版时间：15 February 2017
• 年：2017
• 卷：488
• 期：Complete
• 页码：72-78
• 全文大小：2335 K
• 卷排序：488

文摘

Continuous silver shells were deposited on copper flakes using a two-stage precipitation process. A tightly packed layer of silver nanoparticles was first formed on the surface of the base metal by galvanic displacement. The size of the noble metal particles and their distribution on the substrate were controlled using complexing agents and dispersants. A continuous Ag deposit was subsequently grown by reducing slowly [Ag(NH3)2]+ ions with glucose. The final shell thickness was controlled by varying the amount of metal deposited in the second step. The electrical properties of resulting silver coated copper flakes are comparable to those measured for silver flakes of similar size and aspect ratio. By preventing the oxidation of copper cores up to 400 °C, the hermetic noble metal shell dramatically extends the temperature range in which Ag/Cu flakes can successfully replace pure silver.