Experimentally investigating the thermal mixing and thermal stripping characteristics in a T-junction

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• 作者：G.Y. Chuang ; Y.M. Ferng ; ^{ymferng@ess.nthu.edu.tw}
• 关键词：T-junction ; Thermal mixing and stripping ; Reverse flow ; Power spectrum density
• 刊名：Applied Thermal Engineering
• 出版年：2017
• 出版时间：25 February 2017
• 年：2017
• 卷：113
• 期：Complete
• 页码：1585-1595
• 全文大小：2775 K
• 卷排序：113

文摘

This paper experimentally study thermal mixing and stripping in a T-junction. Vr is a good indicator to present thermal mixing for a T-junction. MR is suitable to determine the reverse flow upstream a T-junction. The reverse flow occurs for MR < 0.05, which has the generality. Thermal fatigue for a T-junction is severe near the intersection.