A high mobility ambipolar field effect transistor (FET) was fabricated using a double-layer structure composed of 2,6-diphenylbenzo[1,2-b:4,5-b′]diselenophene (DPh-BDS) as a p-type layer and fullerene
(C60) as an n-type layer. The FET characteristics showed a large dependence on the DPh-BDS thickness, and excellent ambipolar behavior with the maximum electron and hole mobilities of
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and
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was obtained with the optimum DPh-BDS thickness of 10–20 nm. The result indicates that the
μe of
C60 was considerably enhanced by keeping it away from the electron traps on the SiO
2 surface and by improving the crystalline texture of the
C60, which was achieved by the underlying DPh-BDS buffer layer having a rather high hole mobility on the SiO
2 layer.