Whisker growth from vacuum evaporated submicron Sn thin films

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• 作者：Balá ; zs Illé ; s^a ; ^{billes@ett.bme.hu} ; Agata Skwarek^b ; Ré ; ka Bá ; torfi^a ; Jacek Ratajczak^c ; Andrzej Czerwinski^c ; Olivé ; r Krammer^a ; Bá ; lint Medgyes^a ; Barbara Horvá ; th^d ; Tamá ; s Hurtony^a
• 关键词：Tin whisker ; Thin film ; Intermetallics ; Interface flow ; TEM
• 刊名：Surface and Coatings Technology
• 出版年：2017
• 出版时间：15 February 2017
• 年：2017
• 卷：311
• 期：Complete
• 页码：216-222
• 全文大小：1932 K
• 卷排序：311

文摘

Tin whisker growth from submicron Sn thin films at room temperature was studied. Considerable tin whisker development was found on Sn thin films with Cu substrate. The longest filament whiskers reached 300 μm in length. Surface roughness of the IMC layer has a great effect on whisker growth from Sn thin film. First evidences were found in a tin-copper layer system to interfacial flow mechanism.