Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles
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- 作者：Xiaoping Dai ; Yangang Wang ; yangang_wang@dynexsemi.com" class="auth_mail" title="E-mail the corresponding author ; Yibo Wu ; Haihui Luo ; Guoyou Liu ; Daohui Li ; Steve Jones
- 关键词：Direct liquid cooled ; HEV/EV ; IGBT ; Packaging ; Power module ; Reliability
- 刊名：Microelectronics Reliability
- 出版年：2016
- 出版时间：September 2016
- 年：2016
- 卷：64
- 期：Complete
- 页码：474-478
- 全文大小：1035 K
文摘
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Integrated direct liquid cooled (DLC) power module with enhanced reliability for HEV/EV is developed.
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Al DLC structure gives rise to 40% reduction of weight and cost, and 50% reduction of junction to heat sink thermal resistance.
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Die lead bonding is proposed for interconnection to reduce parasitics by 50%. Advanced die and terminal attach technologies are suggested.
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The predicted lifetime of the DLC module is qualified for HEV/EV application.