Influence of the Cu2O morphology on the metallization of Al2O3 ceramics
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- 作者：Jing-Wu Zheng ; zhengjw@zjut.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Deng-Ming Gao ; Liang Qiao ; Yao Ying ; Wang-Chang Li ; Li-Qiang Jiang ; Sheng-Lei Che
- 关键词：Cu2O film ; Electro-deposition ; Metallization ; Al2O3 ceramic ; Bonding strength
- 刊名：Surface and Coatings Technology
- 出版年：2016
- 出版时间：15 January 2016
- 年：2016
- 卷：285
- 期：Complete
- 页码：249-254
- 全文大小：1187 K
文摘
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Investigated the effect of pH value on the Cu2O film microstructure.
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Both CuAlO2 and CuAl2O4 are found at the Cu/Al2O3 interface after DBC process.
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A thin layer of discontinuous interfacial product can be detected when reacts 7 h.
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The morphology of Cu2O grains significantly affects the Cu/Al2O3 bonding strength.
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The adhesion strength of Cu2O/Cu drops from 4950 to 3935 mN with increasing pH.