Microstructure evolution and mechanical properties of transient liquid phase bonded Ti-6Al-4V joint with copper interlayer
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- 作者：Yongqiang Deng ; Guangmin Sheng ; gmsheng@cqu.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Fangli Wang ; Xinjian Yuan ; Qi An
- 关键词：Ti&ndash ; 6Al&ndash ; 4V ; Copper interlayer ; Transient liquid phase bonding ; Microstructure ; Mechanical properties
- 刊名：Materials & Design
- 出版年：2016
- 出版时间：15 February 2016
- 年：2016
- 卷：92
- 期：Complete
- 页码：1-7
- 全文大小：1316 K
文摘
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A low cost transient liquid phase bonding technique of Ti–6Al–4V was developed.
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Bonding strength comparable with Ti–6Al–4V base metal was achieved.
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Correlation between microstructure and strength of the bonded joints was elucidated.
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Lower temperature combining longer bonding time is preferred for joining Ti–6Al–4V.