The ato
mic layer deposition of W
2O
3 fil
ms was de
monstrated e
mploying W
2(NMe
2)
6 and water as precursors with substrate te
mperatures between 140 and 240
![](/i<font color=)
mages/entities/deg.
gif">C. At 180
![](/i<font color=)
mages/entities/deg.
gif">C, surface saturative growth was achieved with W
2(NMe
2)
6 vapor pulse lengths of
![](/i<font color=)
mages/entities/ge.
gif">2 s. The growth rate was about 1.4 Å/cycle at substrate te
mperatures between 140 and 200
![](/i<font color=)
mages/entities/deg.
gif">C. Growth rates of 1.60 and 2.10 Å/cycle were observed at 220 and 240
![](/i<font color=)
mages/entities/deg.
gif">C, respectively. In a series of fil
ms deposited at 180
![](/i<font color=)
mages/entities/deg.
gif">C, the fil
m thicknesses varied linearly with the nu
mber of deposition cycles. Ti
me-of-flight elastic recoil analyses de
monstrated stoichio
metric W
2O
3 fil
ms, with carbon, hydrogen, and nitrogen levels between 6.3 and 8.6, 11.9 and 14.2, and 4.6 and 5.0 at. %, respectively, at substrate te
mperatures of 160, 180, and 200
![](/i<font color=)
mages/entities/deg.
gif">C. The as-deposited fil
ms were a
morphous. Ato
mic force
microscopy showed root-
mean-square surface roughnesses of 0.7 and 0.9 n
m for fil
ms deposited at 180 and 200
![](/i<font color=)
mages/entities/deg.
gif">C, respectively. The resistivity of a fil
m grown at 180
![](/i<font color=)
mages/entities/deg.
gif">C was 8500
microh
m c
m.