Atomic Layer Deposition of Tungsten(III) Oxide Thin Films from W2(NMe2)6 and Water: Precursor-Based Control of Oxidation State in the Thin Film Material
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The atomic layer deposition of W2O3 films was demonstrated employing W2(NMe2)6 and water as precursors with substrate temperatures between 140 and 240 mages/entities/deg.gif">C. At 180 mages/entities/deg.gif">C, surface saturative growth was achieved with W2(NMe2)6 vapor pulse lengths of mages/entities/ge.gif">2 s. The growth rate was about 1.4 Å/cycle at substrate temperatures between 140 and 200 mages/entities/deg.gif">C. Growth rates of 1.60 and 2.10 Å/cycle were observed at 220 and 240 mages/entities/deg.gif">C, respectively. In a series of films deposited at 180 mages/entities/deg.gif">C, the film thicknesses varied linearly with the number of deposition cycles. Time-of-flight elastic recoil analyses demonstrated stoichiometric W2O3 films, with carbon, hydrogen, and nitrogen levels between 6.3 and 8.6, 11.9 and 14.2, and 4.6 and 5.0 at. %, respectively, at substrate temperatures of 160, 180, and 200 mages/entities/deg.gif">C. The as-deposited films were amorphous. Atomic force microscopy showed root-mean-square surface roughnesses of 0.7 and 0.9 nm for films deposited at 180 and 200 mages/entities/deg.gif">C, respectively. The resistivity of a film grown at 180 mages/entities/deg.gif">C was 8500 microhm cm.

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