Photo-Cross-Linking-Assisted Thermal Stability of DNA Origami Structures and Its Application for Higher-Temperature Self-Assembly

详细信息    查看全文

• 作者：Arivazhagan Rajendran ; Masayuki Endo ; Yousuke Katsuda ; Kumi Hidaka ; Hiroshi Sugiyama
• 刊名：Journal of the American Chemical Society
• 出版年：2011
• 出版时间：September 21, 2011
• 年：2011
• 卷：133
• 期：37
• 页码：14488-14491
• 全文大小：825K
• 年卷期：v.133,no.37(September 21, 2011)
• ISSN：1520-5126

文摘

Heat tolerance of DNA origami structures has been improved about 30 掳C by photo-cross-linking of 8-methoxypsoralen. To demonstrate one of its applications, the cross-linked origami were used for higher-temperature self-assembly, which markedly increased the yield of the assembled product when compared to the self-assembly of non-cross-linked origami at lower-temperature. By contrast, at higher-temperature annealing, native non-cross-linked tiles did not self-assemble to yield the desired product; however, they formed a nonspecific broken structure.