The Effect of Oven-Heat Flux on Powder-Coating Issues of Sheet Molding Compound Panels

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• 作者：Soumendra K. Basu ; Bhavesh Shah ; Hamid G. Kia
• 刊名：Industrial & Engineering Chemistry Research
• 出版年：2009
• 出版时间：February 4, 2009
• 年：2009
• 卷：48
• 期：3
• 页码：1638-1649
• 全文大小：468K
• 年卷期：v.48,no.3(February 4, 2009)
• ISSN：1520-5045

文摘

The effects of variations in the powder bake temperature profile on the paint popping defect of sheet molding compound (SMC) panels was investigated by subjecting powder-coated panels to various heating rates using IR heaters and convective ovens, and by using a mathematical model of heat transfer and curing reaction. It was found that overheating the SMC than that required for optimum powder curing can cause high rates of outgassing of absorbed moisture and, therefore, excessive popping. It was further found that higher quantity of moisture outgassing per unit time through the molten primer layer during a fast temperature ramp causes more popping compared to a slow temperature ramp. Therefore, it is expected that any plant that is experiencing paint popping would benefit from slowing down the rate of temperature rise of the panels during the initial 5−10 min of the heating cycle.